Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness

An integrated circuit package (10) includes a first non-conductive substrate (20) having a first inner surface (32) and a second non-conductive substrate (22) having a second inner surface (46). A die (18) having a first thickness (52) is disposed between the first and second inner surfaces. A leadf...

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Bibliographische Detailangaben
Hauptverfasser:	GERBSCH, ERICH W, MOCK, ROGER A
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	An integrated circuit package (10) includes a first non-conductive substrate (20) having a first inner surface (32) and a second non-conductive substrate (22) having a second inner surface (46). A die (18) having a first thickness (52) is disposed between the first and second inner surfaces. A leadframe (12) includes a member (58) having a proximal end and a distal end. The proximal end has a second thickness (54) less than the first thickness. The distal end is disposed between the first and second inner surfaces. The distal end is undulated such that the distal end has an effective thickness greater than the second thickness.