Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness
An integrated circuit package (10) includes a first non-conductive substrate (20) having a first inner surface (32) and a second non-conductive substrate (22) having a second inner surface (46). A die (18) having a first thickness (52) is disposed between the first and second inner surfaces. A leadf...
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| creator | GERBSCH, ERICH W MOCK, ROGER A |
| description | An integrated circuit package (10) includes a first non-conductive substrate (20) having a first inner surface (32) and a second non-conductive substrate (22) having a second inner surface (46). A die (18) having a first thickness (52) is disposed between the first and second inner surfaces. A leadframe (12) includes a member (58) having a proximal end and a distal end. The proximal end has a second thickness (54) less than the first thickness. The distal end is disposed between the first and second inner surfaces. The distal end is undulated such that the distal end has an effective thickness greater than the second thickness. |
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A die (18) having a first thickness (52) is disposed between the first and second inner surfaces. A leadframe (12) includes a member (58) having a proximal end and a distal end. The proximal end has a second thickness (54) less than the first thickness. The distal end is disposed between the first and second inner surfaces. The distal end is undulated such that the distal end has an effective thickness greater than the second thickness.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2012</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20120111&DB=EPODOC&CC=EP&NR=1564811B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20120111&DB=EPODOC&CC=EP&NR=1564811B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>GERBSCH, ERICH W</creatorcontrib><creatorcontrib>MOCK, ROGER A</creatorcontrib><title>Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness</title><description>An integrated circuit package (10) includes a first non-conductive substrate (20) having a first inner surface (32) and a second non-conductive substrate (22) having a second inner surface (46). 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A die (18) having a first thickness (52) is disposed between the first and second inner surfaces. A leadframe (12) includes a member (58) having a proximal end and a distal end. The proximal end has a second thickness (54) less than the first thickness. The distal end is disposed between the first and second inner surfaces. The distal end is undulated such that the distal end has an effective thickness greater than the second thickness.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness |
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