Polishing apparatus and method of polishing work piece

The polishing apparatus is capable of changing a pH value of slurry to adjust polishing rate and polishing a work piece with high flatness. The polishing apparatus comprises: a pressure vessel (12); a polishing plate (23) provided in the pressure vessel (12); a pressing plate (36) pressing a work pi...

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Bibliographische Detailangaben
Hauptverfasser:	PHILIPOSSIAN, ARA, DENARDIS, DARREN, DOI, TOSHIRO
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	The polishing apparatus is capable of changing a pH value of slurry to adjust polishing rate and polishing a work piece with high flatness. The polishing apparatus comprises: a pressure vessel (12); a polishing plate (23) provided in the pressure vessel (12); a pressing plate (36) pressing a work piece onto the polishing plate (23); a driving unit (35) relatively moving the polishing plate (23) with respect to the pressing plate (36) so as to polish the work piece; a gas supplying source (71, 72) supplying an alkaline gas or an acid gas into the pressure vessel (12); a gas discharging section (48) discharging the supplied gas from the pressure vessel (12); and a slurry supplying unit (45) supplying slurry onto the polishing plate (23). A pH value of the slurry is adjusted by dissolving the alkaline gas or the acid gas in the slurry.