Flip chip heat sink package and method

An electronic package (10) having enhanced heat dissipation is provided exhibiting dual conductive heat paths (40, 42) in opposing directions. The package (10) includes a substrate (16) having electrical conductors thereon and a flip chip (12) mounted to the substrate (16). The flip chip (12) has a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Zimmerman, David W, Mandel, Larry M, Sarma, Dwadasi H, Gertiser, Kevin M, Chengalva, Suresh K
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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