Flip chip heat sink package and method

An electronic package (10) having enhanced heat dissipation is provided exhibiting dual conductive heat paths (40, 42) in opposing directions. The package (10) includes a substrate (16) having electrical conductors thereon and a flip chip (12) mounted to the substrate (16). The flip chip (12) has a first surface, solder bumps (14) on the first surface, and a second surface oppositely disposed from the first surface. The flip chip (12) is mounted to the substrate (16) such that the solder bumps (14) are registered with the conductors on the substrate (16). The package (10) further includes a stamped metal heat sink (30) in heat transfer relationship with the second surface of the flip chip (12). The heat sink (30) includes a cavity (32) formed adjacent to the flip chip (12) containing a thermally conductive material (34).