ELECTRONIC COMPONENT COMPRISING A MULTILAYER WIRING FRAME AND METHOD FOR PRODUCING THE SAME

The invention relates to an electronic component having a multilayered rewiring plate, which carries a circuit chip, in particular a magnetic memory chip, and connects contact areas of the chip to external contacts of the electronic component via rewiring lines. The rewiring plate has at least one p...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	WENNEMUTH, INGO, THOMAS, JOCHEN
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OR TREATMENT OF NANOSTRUCTURES MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES NANOTECHNOLOGY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES TRANSPORTING
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Beschreibung
Zusammenfassung:	The invention relates to an electronic component having a multilayered rewiring plate, which carries a circuit chip, in particular a magnetic memory chip, and connects contact areas of the chip to external contacts of the electronic component via rewiring lines. The rewiring plate has at least one patterned, magnetic shielding layer made of an amorphous metal or an amorphous metal alloy. Furthermore, the invention encompasses a method for producing this electronic component.