SEMICONDUCTOR DEVICE AND ITS PRODUCING METHOD

A semiconductor device includes a substrate, a pad electrode formed on the substrate and a bump electrode formed on the pad electrode, wherein the pad electrode has an irregular flaw, and there is provided a pattern covering the irregular flaw between the pad electrode an the bump electrode.

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SATOH, AKIRA, TOIDA, YASUSHI, MISAWA, KAZUHIRO, MURATA, KOICHI, TAMAGAWA, MICHIAKI, WATANABE, EIJI, ISHIGURI, MASAHIKO, CHIBA, SHUICHI
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A semiconductor device includes a substrate, a pad electrode formed on the substrate and a bump electrode formed on the pad electrode, wherein the pad electrode has an irregular flaw, and there is provided a pattern covering the irregular flaw between the pad electrode an the bump electrode.