SOLDER PASTE FLUX SYSTEM

The present invention is directed to a solder flux and solder paste that comprises methylsuccinic acid as an activating component and an imidazole compound as an accelerating component. The imidizole compound is selected from the following: 2-methyl-4-ethylimidazole, 2-methylimidazole and 2-ethylimi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	PRICE, ANDREW, DAVID, ARZADON, BENSOL, SEQUEIRA, LEELA, JOSEPHINE, HOZER, LESZEK
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The present invention is directed to a solder flux and solder paste that comprises methylsuccinic acid as an activating component and an imidazole compound as an accelerating component. The imidizole compound is selected from the following: 2-methyl-4-ethylimidazole, 2-methylimidazole and 2-ethylimidazole and mixtures thereof. The present invention is also directed to a method for preparing the above-described solder flux and method for soldering using the solder flux paste. It is also directed to an electronic component assembly joined using the solder flux paste.