Standoff/mask structure for electrical interconnect

The structure has an adhesive standoff layer attached to a liner layer. Standoff apertures (63) are formed in the liner layer and the adhesive standoff layer. A mask adhesive layer is attached to the liner layer. A mask liner layer (75) is attached to the mask adhesive layer. Mask apertures are formed in the mask adhesive layer and the mask liner layer in alignment with the standoff apertures. Independent claims are also included for the following: (a) a method of making a standoff/mask structure (b) a method of making an interconnected electrical circuit structure. A multi-layer standoff/mask structure including a standoff having a plurality of standoff openings and a mask having a plurality of mask openings aligned with the standoff openings. The structure is employed for forming interconnecting structures on electronic circuit structures.