DEVICE FOR CUTTING A SUBSTRATE LAYER AND CORRESPONDING METHOD

DEVICE FOR CUTTING A SUBSTRATE LAYER AND CORRESPONDING METHOD

A method is presented for cutting an assembly that includes two layers of material having a first surface and a second surface. The method includes providing a weakened interface between the two layers that defines an interface ring about the periphery of the assembly, providing a high-pressure zone...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LETERTRE, FABRICE, RAYSSAC, OLIVIER
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
TRANSPORTING
WORKING CEMENT, CLAY, OR STONE
WORKING STONE OR STONE-LIKE MATERIALS
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Beschreibung
Zusammenfassung:A method is presented for cutting an assembly that includes two layers of material having a first surface and a second surface. The method includes providing a weakened interface between the two layers that defines an interface ring about the periphery of the assembly, providing a high-pressure zone at the interface ring, and providing at least one controllable low-pressure zone in the vicinity of at least one of the first surface and the second surface. The technique also includes supplying the high-pressure zone with a controllable high-pressure force, and attacking the interface ring with at least one mechanical force in combination with the high-pressure force to cut the assembly.