Resin sealed electronic assembly and method of manufacturing the same

Resin sealed electronic assembly and method of manufacturing the same

A resin-sealed electronic circuit apparatus capable of maintaining a high heat-dissipating property and packaging density in applications where high hermetic-sealing property and durability are required. The electronic circuit apparatus comprises at least two wiring circuit boards (12, 13) on which...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MASUDA, MITSUHIRO, TSUYUNO, NOBUTAKE, URUSHIWARA, NORIYOSHI, ISHI, TOSHIAKI, MATSUSHITA, AKIRA
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
BLASTING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMBUSTION ENGINES
CONTROLLING COMBUSTION ENGINES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HEATING
HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
LIGHTING
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MECHANICAL ENGINEERING
PERFORMING OPERATIONS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
TRANSPORTING
VEHICLES IN GENERAL
VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISEPROVIDED FOR
WEAPONS
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Beschreibung
Zusammenfassung:A resin-sealed electronic circuit apparatus capable of maintaining a high heat-dissipating property and packaging density in applications where high hermetic-sealing property and durability are required. The electronic circuit apparatus comprises at least two wiring circuit boards (12, 13) on which electronic components are mounted. The wiring circuit boards (12, 13) are fixed to a heat sink (14) having a high heat conductivity via an adhesive (9, 10). The entirety of the wiring circuit boards (12, 13) and heat sink (14), as well as a part of an external connection terminal (8) are hermetically sealed and integrally molded by a thermosetting resin composition (7). The electronic circuit apparatus is small and highly reliable and can be provided at low cost.