METHOD FOR THE TREATMENT OF ELECTRICALLY CONDUCTIVE SUBSTRATES AND PRINTED CIRCUIT BOARDS AND THE LIKE

The invention relates to a method for the treatment of printed circuit boards, printed circuits and the like, wherein a metal, especially copper, is removed initially by pulsed electrochemical etching and is subsequently removed by chemical etching. As a result, anisotropic removal of the metal is p...

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Bibliographische Detailangaben
Hauptverfasser:	SCHMID, CHRISTIAN, ROGOLL, VOLKER, FAUSER, HEIDI, FREUDENBERGER, RENATE, ZIELONKA, ANDREAS
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROMOBJECTS
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Beschreibung
Zusammenfassung:	The invention relates to a method for the treatment of printed circuit boards, printed circuits and the like, wherein a metal, especially copper, is removed initially by pulsed electrochemical etching and is subsequently removed by chemical etching. As a result, anisotropic removal of the metal is possible and structures which are deeper than the width thereof are obtained.