METHOD FOR FORMING ELECTROPLATED COATING ON SURFACE OF ARTICLE

An object of the present invention is to provide a method for forming a uniform and dense electroplating film with high adhesion strength on the surface of an article, yet irrespective of the surface material and the surface properties of the article. A means for a solution of the problem comprises:...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KIKUI, FUMIAKI, YOSHIMURA, KOHSHI
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INDUCTANCES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MAGNETS METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSFORMERS
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Beschreibung
Zusammenfassung:	An object of the present invention is to provide a method for forming a uniform and dense electroplating film with high adhesion strength on the surface of an article, yet irrespective of the surface material and the surface properties of the article. A means for a solution of the problem comprises: forming on the surface of the article, a resin coating made of a resin containing dispersed therein a powder of a first metal; then forming a second-metal substituted plating film on the surface of the resin coating by immersing the resin-coated article in a solution containing ions of a second metal having an ionization potential nobler than that of the first metal; and further forming an electroplating film of a third metal on the surface of the metal-substituted plating film.