THIN FILM TRANSISTOR DEVICE AND METHOD OF MANUFACTURING SAME
The electronic device comprises a thin-film transistor ( 10 ) and can be obtained from two substrates ( 1, 11 ). In order to preclude delamination at a non-adhesive interface between a metal pattern ( 24, 29 ) and an organic layer ( 4 ), the metal pattern ( 24, 29 ) comprises apertures ( 30 ). Throu...
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creator | MONTREE, ANDREAS, H VAN DE WALLE, GERJAN, F., A |
description | The electronic device comprises a thin-film transistor ( 10 ) and can be obtained from two substrates ( 1, 11 ). In order to preclude delamination at a non-adhesive interface between a metal pattern ( 24, 29 ) and an organic layer ( 4 ), the metal pattern ( 24, 29 ) comprises apertures ( 30 ). Through these apertures ( 30 ), adhesion between the organic layer ( 4, 5 ) and organic material at the surface ( 111 ) of one of the substrates ( 11 ) can be brought about. The electronic device can be manufactured by use of microcontact printing. |
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In order to preclude delamination at a non-adhesive interface between a metal pattern ( 24, 29 ) and an organic layer ( 4 ), the metal pattern ( 24, 29 ) comprises apertures ( 30 ). Through these apertures ( 30 ), adhesion between the organic layer ( 4, 5 ) and organic material at the surface ( 111 ) of one of the substrates ( 11 ) can be brought about. 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In order to preclude delamination at a non-adhesive interface between a metal pattern ( 24, 29 ) and an organic layer ( 4 ), the metal pattern ( 24, 29 ) comprises apertures ( 30 ). Through these apertures ( 30 ), adhesion between the organic layer ( 4, 5 ) and organic material at the surface ( 111 ) of one of the substrates ( 11 ) can be brought about. The electronic device can be manufactured by use of microcontact printing.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | THIN FILM TRANSISTOR DEVICE AND METHOD OF MANUFACTURING SAME |
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