THIN FILM TRANSISTOR DEVICE AND METHOD OF MANUFACTURING SAME
The electronic device comprises a thin-film transistor ( 10 ) and can be obtained from two substrates ( 1, 11 ). In order to preclude delamination at a non-adhesive interface between a metal pattern ( 24, 29 ) and an organic layer ( 4 ), the metal pattern ( 24, 29 ) comprises apertures ( 30 ). Throu...
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creator | MONTREE, ANDREAS, H VAN DE WALLE, GERJAN, F., A |
description | The electronic device comprises a thin-film transistor ( 10 ) and can be obtained from two substrates ( 1, 11 ). In order to preclude delamination at a non-adhesive interface between a metal pattern ( 24, 29 ) and an organic layer ( 4 ), the metal pattern ( 24, 29 ) comprises apertures ( 30 ). Through these apertures ( 30 ), adhesion between the organic layer ( 4, 5 ) and organic material at the surface ( 111 ) of one of the substrates ( 11 ) can be brought about. The electronic device can be manufactured by use of microcontact printing. |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP1438753B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP1438753B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP1438753B13</originalsourceid><addsrcrecordid>eNrjZLAJ8fD0U3Dz9PFVCAly9Av2DA7xD1JwcQ3zdHZVcPRzUfB1DfHwd1Hwd1PwdfQLdXN0DgkN8vRzVwh29HXlYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxrgGGJsYW5qbGTobGRCgBAKgaKRI</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>THIN FILM TRANSISTOR DEVICE AND METHOD OF MANUFACTURING SAME</title><source>esp@cenet</source><creator>MONTREE, ANDREAS, H ; VAN DE WALLE, GERJAN, F., A</creator><creatorcontrib>MONTREE, ANDREAS, H ; VAN DE WALLE, GERJAN, F., A</creatorcontrib><description>The electronic device comprises a thin-film transistor ( 10 ) and can be obtained from two substrates ( 1, 11 ). In order to preclude delamination at a non-adhesive interface between a metal pattern ( 24, 29 ) and an organic layer ( 4 ), the metal pattern ( 24, 29 ) comprises apertures ( 30 ). Through these apertures ( 30 ), adhesion between the organic layer ( 4, 5 ) and organic material at the surface ( 111 ) of one of the substrates ( 11 ) can be brought about. The electronic device can be manufactured by use of microcontact printing.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2010</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20100407&DB=EPODOC&CC=EP&NR=1438753B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,782,887,25571,76555</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20100407&DB=EPODOC&CC=EP&NR=1438753B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MONTREE, ANDREAS, H</creatorcontrib><creatorcontrib>VAN DE WALLE, GERJAN, F., A</creatorcontrib><title>THIN FILM TRANSISTOR DEVICE AND METHOD OF MANUFACTURING SAME</title><description>The electronic device comprises a thin-film transistor ( 10 ) and can be obtained from two substrates ( 1, 11 ). In order to preclude delamination at a non-adhesive interface between a metal pattern ( 24, 29 ) and an organic layer ( 4 ), the metal pattern ( 24, 29 ) comprises apertures ( 30 ). Through these apertures ( 30 ), adhesion between the organic layer ( 4, 5 ) and organic material at the surface ( 111 ) of one of the substrates ( 11 ) can be brought about. The electronic device can be manufactured by use of microcontact printing.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2010</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAJ8fD0U3Dz9PFVCAly9Av2DA7xD1JwcQ3zdHZVcPRzUfB1DfHwd1Hwd1PwdfQLdXN0DgkN8vRzVwh29HXlYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxrgGGJsYW5qbGTobGRCgBAKgaKRI</recordid><startdate>20100407</startdate><enddate>20100407</enddate><creator>MONTREE, ANDREAS, H</creator><creator>VAN DE WALLE, GERJAN, F., A</creator><scope>EVB</scope></search><sort><creationdate>20100407</creationdate><title>THIN FILM TRANSISTOR DEVICE AND METHOD OF MANUFACTURING SAME</title><author>MONTREE, ANDREAS, H ; VAN DE WALLE, GERJAN, F., A</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP1438753B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2010</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>MONTREE, ANDREAS, H</creatorcontrib><creatorcontrib>VAN DE WALLE, GERJAN, F., A</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MONTREE, ANDREAS, H</au><au>VAN DE WALLE, GERJAN, F., A</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>THIN FILM TRANSISTOR DEVICE AND METHOD OF MANUFACTURING SAME</title><date>2010-04-07</date><risdate>2010</risdate><abstract>The electronic device comprises a thin-film transistor ( 10 ) and can be obtained from two substrates ( 1, 11 ). In order to preclude delamination at a non-adhesive interface between a metal pattern ( 24, 29 ) and an organic layer ( 4 ), the metal pattern ( 24, 29 ) comprises apertures ( 30 ). Through these apertures ( 30 ), adhesion between the organic layer ( 4, 5 ) and organic material at the surface ( 111 ) of one of the substrates ( 11 ) can be brought about. The electronic device can be manufactured by use of microcontact printing.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | THIN FILM TRANSISTOR DEVICE AND METHOD OF MANUFACTURING SAME |
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