THIN FILM TRANSISTOR DEVICE AND METHOD OF MANUFACTURING SAME

The electronic device comprises a thin-film transistor ( 10 ) and can be obtained from two substrates ( 1, 11 ). In order to preclude delamination at a non-adhesive interface between a metal pattern ( 24, 29 ) and an organic layer ( 4 ), the metal pattern ( 24, 29 ) comprises apertures ( 30 ). Throu...

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Bibliographische Detailangaben
Hauptverfasser: MONTREE, ANDREAS, H, VAN DE WALLE, GERJAN, F., A
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:The electronic device comprises a thin-film transistor ( 10 ) and can be obtained from two substrates ( 1, 11 ). In order to preclude delamination at a non-adhesive interface between a metal pattern ( 24, 29 ) and an organic layer ( 4 ), the metal pattern ( 24, 29 ) comprises apertures ( 30 ). Through these apertures ( 30 ), adhesion between the organic layer ( 4, 5 ) and organic material at the surface ( 111 ) of one of the substrates ( 11 ) can be brought about. The electronic device can be manufactured by use of microcontact printing.