MULTI-MILLING METHOD FOR THE PRODUCTION OF PRINTED CIRCUITS AND THE PRINTED CIRCUITS THUS OBTAINED

A multiple-milling process for manufacturing printed circuits and the printed circuit thus obtained, constituted by a process for preparing the substrate of the printed circuit boards (1) for the production of bending areas (2) from whence to bend said printed circuits (1). This process consists of...

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Bibliographische Detailangaben
1. Verfasser:	PINANA LOPEZ, RAMON
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	A multiple-milling process for manufacturing printed circuits and the printed circuit thus obtained, constituted by a process for preparing the substrate of the printed circuit boards (1) for the production of bending areas (2) from whence to bend said printed circuits (1). This process consists of a multiple-milling system, by means of a mill (3) with special features, comprising a roll provided with multiple polishing strips on its surface, capable of making an undercutting in parallel strips (4) in said bending areas (2) of a printed circuit (1), allowing for their subsequent bending without deteriorating the metallic material conductive tracks adhered to the printed board's substrate on the side opposite the milled surface.