Vertically adjustable chemical mechanical polishing head having a pivot mechanism and method for use thereof

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Bibliographische Detailangaben
Hauptverfasser:	WANG, HUEY-MING, MOLONEY, GERARD, LIU, JUN, SAKURAI, KUNIHIKO, LAO, PETER
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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