METHOD AND ELECTRODE FOR DEFINING AND REPLICATING STRUCTURES IN CONDUCTING MATERIALS

The present invention concerns an electrochemical pattern replication method, ECPR, and a construction of a conductive electrode for production of applications involving micro and nano structures. An etching or plating pattern, which is defined by a conductive electrode, a master electrode (8), is r...

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Bibliographische Detailangaben
Hauptverfasser:	WIVEN-NILSSON, PETER, FREDENBERG, MIKAEL, MOELLER, PATRIK
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTIONOF COMPOUNDS OR NON-METALS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROMOBJECTS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS TRANSPORTING
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Beschreibung
Zusammenfassung:	The present invention concerns an electrochemical pattern replication method, ECPR, and a construction of a conductive electrode for production of applications involving micro and nano structures. An etching or plating pattern, which is defined by a conductive electrode, a master electrode (8), is replicated on an electrically conductive material, a substrate (9). The master electrode (8) is put in close contact with the substrate (9) and the etching/plating pattern is directly transferred onto the substrate (9) by using a contact etching/plating process. The contact etching/plating process is performed in local etching/plating cells (12,14), that are formed in closed or open cavities between the master electrode (8) and the substrate (9).