Leach-resistant solder alloys for silver-based thick-film conductors

A tin-lead solder alloy containing copper and/or nickel and optionally silver, palladium, platinum and/or gold as its alloying constituents. The solder alloy consists essentially of, by weight, about 5% to about 70 % tin, up to about 4% silver palladium, platinum and/or gold, about 0.5 % to about 10...

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Bibliographische Detailangaben
Hauptverfasser:	YEH, SHING, CARTER, BRADLEY H
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ALLOYS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A tin-lead solder alloy containing copper and/or nickel and optionally silver, palladium, platinum and/or gold as its alloying constituents. The solder alloy consists essentially of, by weight, about 5% to about 70 % tin, up to about 4% silver palladium, platinum and/or gold, about 0.5 % to about 10% copper and/or nickel, the balance lead and incidental impurities. The presence of copper and/or nickel in the alloy has the beneficial effect of inhibiting the dissolution and leaching of silver from a silver-containing thick-film, such as a conductor (18) or solder pad (16), into the molten solder alloy during reflow. In addition, solder joints (22) formed of the solder alloy form a diffusion barrier layer (24,26) of intermetallic compounds that inhibit solid-state interdiffusion between silver from a silver-containing thick-film (16,18) and tin from the solder joint (22).