APPARATUS FOR NON-DESTRUCTIVE TESTING OF LEADED PACKAGES

A method of non-destructively testing the adhesion of electrical leads joined to a package comprising the steps of holding the package and a portion of a lead in respective stationary positions, applying a force to the lead proximate an area where it's joined to the package, and measuring the r...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SZWEC, RICHARD, DONOHO, EDWARD
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	A method of non-destructively testing the adhesion of electrical leads joined to a package comprising the steps of holding the package and a portion of a lead in respective stationary positions, applying a force to the lead proximate an area where it's joined to the package, and measuring the resistance of the lead to the force. An apparatus for holding the package and leads during such testing comprising first and second holding members, each having three arms connected by a transverse member.