ADHESIVE DETACKIFICATION METHOD

The invention describes a method of curing a polymerizable material containing ethylenically unsaturated bonds at a temperature of 60° C. or less, comprising the steps of (a) providing a curative comprising an effective amount of a light-stable isomer of a 2,4,5-triarylimidazolyl dimer, such as bilo...

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Bibliographische Detailangaben
Hauptverfasser:	STEBBINGS, WILLIAM L, PERRY, DALE C, LANDGREBE, KEVIN D
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BLASTING CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMBINED HEATING AND REFRIGERATION SYSTEMS COMPOSITIONS BASED THEREON CORRECTING FLUIDS DYES FILLING PASTES HEAT PUMP SYSTEMS HEATING INKS LIGHTING LIQUEFACTION SOLIDIFICATION OF GASES MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MANUFACTURE OR STORAGE OF ICE MECHANICAL ENGINEERING METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES REFRIGERATION MACHINES, PLANTS OR SYSTEMS REFRIGERATION OR COOLING THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES USE OF MATERIALS THEREFOR WEAPONS WOODSTAINS
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Beschreibung
Zusammenfassung:	The invention describes a method of curing a polymerizable material containing ethylenically unsaturated bonds at a temperature of 60° C. or less, comprising the steps of (a) providing a curative comprising an effective amount of a light-stable isomer of a 2,4,5-triarylimidazolyl dimer, such as bilophine; (b) activating said curative by application of an activator selected from the group consisting of solvent and friction; and (c) combining the activated curative with the polymerizable material. Articles comprising an adhesive having a detackified surface, such as adhesive bandages, a detackifying solution, a two-part adhesive system, and a fastening system are also provided.