Laser-activated dielectric material and method for using the same in an electroless deposition process

A method for forming an electrical interconnect structure for a substrate utilizes a dielectric material containing an inorganic filler therein. When the dielectric material is subjected to laser energy, it is simultaneously ablated and activated, thereby catalyzing the deposition of a full-build el...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	JARQUE, MANUEL GARCIA, BAINS, NARINDER, ALBIN, DAVID, GRAVES, JOHN, LUCAS, JEAN-PIERRE, ROSSI, STEPHANIE GROSMAIRE, CHRISTOPH, FRANK, SMEETS, FRANK, GOOSEY, MARTIN, GUYON, PIERRE, DITEL, CLAUDIA
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A method for forming an electrical interconnect structure for a substrate utilizes a dielectric material containing an inorganic filler therein. When the dielectric material is subjected to laser energy, it is simultaneously ablated and activated, thereby catalyzing the deposition of a full-build electroless copper layer thereupon.