PROJECTED GIMBAL POINT DRIVE

A projected gimbal point drive system is disclosed. The projected gimbal point drive system includes a spindle capable of apply a torque, and having a concave spherical surface formed on its lower portion. Further included is a wafer carrier disposed partially within the lower portion of the spindle...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	HALLEY, DAVID, G
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A projected gimbal point drive system is disclosed. The projected gimbal point drive system includes a spindle capable of apply a torque, and having a concave spherical surface formed on its lower portion. Further included is a wafer carrier disposed partially within the lower portion of the spindle. The wafer carrier has a convex spherical surface formed on a surface opposite the concave spherical surface of the spindle. In addition, a drive cup is included that is disposed between the spindle and the wafer carrier. The drive cup has a concave inner surface and a convex outer surface, and allows the wafer carrier to be tilted about a predefined gimbal point. In this manner, torque can be applied without affecting the gimbal action.