Ultrasonic cleaning module and method

The invention provides an ultrasonic cleaning module and a method for cleaning singulated electronic packages. The module comprises a cutting chuck (13) having a surface with a plurality of cutting recesses defined in it for enabling a cutting device to separate individual electronic packages from a...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	SZE, CHAK TONG, CHEUNG, YIU MING
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CLEANING CLEANING IN GENERAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The invention provides an ultrasonic cleaning module and a method for cleaning singulated electronic packages. The module comprises a cutting chuck (13) having a surface with a plurality of cutting recesses defined in it for enabling a cutting device to separate individual electronic packages from a substrate (1) having a plurality of electronic packages on the surface of the chuck. A pulsator nozzle (14) is supported above the chuck (13) and the separated electronic packages on the chuck such that the pulsator nozzle may emit fluid toward the packages. An ultrasonic generator (17) is associated with the nozzle (14) that is adapted to ultrasonically energize fluid that passes through the nozzle (14) to enhance cleaning of the packages.