Method of mounting electrical components on a base plate in a radio frequency terminal unit

Adhesive material (8) is deposited in first regions located between projecting contacts (2, 3) on a base plate (1). A substrate (6) is deposited on the adhesive material and adhered by pressure to the base plate. Electronic components (9) are attached to the top of contacts (3), and electrical conne...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	RIVIERE, FABRICE
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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