Method of mounting electrical components on a base plate in a radio frequency terminal unit

Adhesive material (8) is deposited in first regions located between projecting contacts (2, 3) on a base plate (1). A substrate (6) is deposited on the adhesive material and adhered by pressure to the base plate. Electronic components (9) are attached to the top of contacts (3), and electrical connections (11) are produced between the components and neighboring substrates. Assembling electronic components on a base plate of a radiofrequency base station circuit involves: (a) providing a base plate (1) equipped with, at certain locations, projecting contacts (2, 3) that define between them at least some first regions having selected dimensions; (b) depositing adhesive material (8) into at least some of the first regions; (c) depositing selected substrates (6) into at least some of the first regions; (d) applying a selected pressure on the substrates (6) so as to attach them to the base plate (1) by means of the adhesive material (8); and (e) attaching electronic components (9) to the top of at least some of the projecting contacts, followed by producing electrical connections (11) between the components and the substrates (6) in their vicinity. In stage (a), the projecting contacts (2, 3) also define between them second regions of selected dimensions and at selected positions. In stage (b), the adhesive material (8) is deposited in at least some of the second regions. In stage (c), a conductive layer (7) is deposited in at least some of the second regions (5). In stage (d), pressure is applied on the substrates (6) and the conductive layers (7) so as to attach them to the base plate (1) by means of the adhesive material (8). In stage (e), electrical connections (11) are produced between the electronic components (9) and the conductive layers (7) located in their vicinity. Independent claims are given for: (i) a radiofrequency device obtained by the above process; and (ii) utilization of the device in radiofrequency base station circuits for telecommunications, and in microwave frequency multicast or concast telecommunications installations. Un procédé d'assemblage consiste i) à prendre une plaque de base (1) munie, en des endroits choisis, de plots saillants (2,3) définissant entre eux au moins des premières zones de dimensions choisies, ii) à déposer des moyens d'adhésion (8) dans certaines au moins des premières zones, iii) à déposer un substrat choisi (6) dans certaines au moins des premières zones, iv) à appliquer une pression choisie simultanément sur