INTERCONNECTING MODULE FOR THE BASE OF ELECTRONIC EQUIPMENT CASING

This interconnection module for the base of an electronic device casing carries out the transfer, at the faces of the printed circuit boards ( 4, 5 ) supporting the components of the device housed in the casing, of a field of connection points with the external environment of the casing embodied by the rear ends of the pins of a semi-connector fixed to the back of the casing while still retaining the compactness of the casing despite a very large number of connection points with the external environment of the casing (several hundreds of them). This module takes the form of a three-panel structure with a central panel 7 fixed to the rear ends of the pins of the semi-connector ( 3 ) mounted on the back of the casing and two side panels ( 8, 9 ) folded and placed flat against each other, joined to the longitudinal edges of the central panel ( 7 ) by flexible printed circuit elements ( 10, 11 ) and supporting the field of connection points transferred to the level of the faces of the boards ( 4,5 ) of the electronic device. Electronic connections link the two fields of connection points in going through the joining parts ( 10, 11 ).