Semiconductor device and method for fabricating the same
A group of wires (22) bonding a first semiconductor chip and a second semiconductor chip together extends on the first semiconductor chip and is formed of a film layer (121, 122) (for example through plating) in one continuous process. The second semiconductor chip is then bonded onto the first semi...
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| Format: | Patent |
| Sprache: | eng ; fre ; ger |
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| Zusammenfassung: | A group of wires (22) bonding a first semiconductor chip and a second semiconductor chip together extends on the first semiconductor chip and is formed of a film layer (121, 122) (for example through plating) in one continuous process. The second semiconductor chip is then bonded onto the first semiconductor chip to complete a semiconductor package. |
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