Method of separating a thin semiconductor die from a wafer

A method of separating a thin die (20, 60) from a support body (72) of a semiconductor wafer (70). The thin die (20, 60) being initially attached to the support body (72) by an attachment mechanism (78, 178). The attachment mechanism may be a plurality of tethers (78, 178). The method may include th...

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Bibliographische Detailangaben

Hauptverfasser:	FIELD, CHERY, WANG, JOE PIN, LEFEBVRE, DIDIER R, CHEN, SHIUH-HUI STEVEN
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING RECORD CARRIERS PHYSICS PRESENTATION OF DATA RECOGNITION OF DATA RECORD CARRIERS SEMICONDUCTOR DEVICES
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