High density wire bondable connector assembly

A wire bondable connector assembly (10) is provided. It includes a lead element (12) having a lead portion (14) and a carrier strip portion (16). A first coining area (20) and a second coining area (22) are formed in the lead element (12). The wire bondable connector assembly further includes a conn...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	BEDNARZ, JACOB A, KEY, JASON M, FULK, MIKEL R
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CURRENT COLLECTORS ELECTRICITY LINE CONNECTORS
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