High density wire bondable connector assembly
A wire bondable connector assembly (10) is provided. It includes a lead element (12) having a lead portion (14) and a carrier strip portion (16). A first coining area (20) and a second coining area (22) are formed in the lead element (12). The wire bondable connector assembly further includes a conn...
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| Format: | Patent |
| Sprache: | eng ; fre ; ger |
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| Zusammenfassung: | A wire bondable connector assembly (10) is provided. It includes a lead element (12) having a lead portion (14) and a carrier strip portion (16). A first coining area (20) and a second coining area (22) are formed in the lead element (12). The wire bondable connector assembly further includes a connector housing (18) securing the lead portion (14) of the lead element (12). The connector housing (18) includes a fence element (24) covering the first coining area (20) such that the carrier strip portion (16) may be separated from the lead portion (14) at the second coining area (22), while the lead portion (14) remains secure within the conector housing (18). |
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