ELECTRONIC ASSEMBLY COMPRISING SOLDERABLE THERMAL INTERFACE AND METHODS OF MANUFACTURE

ELECTRONIC ASSEMBLY COMPRISING SOLDERABLE THERMAL INTERFACE AND METHODS OF MANUFACTURE

An assembly comprising: a die (50) having a surface; an adhesion layer (82, 84) of metal coupled to the surface; a solder-wettable layer (86) coupled to the adhesion layer; a lid (52); and a solderable thermally conductive element (60) to couple the lid to the solder-wettable layer.

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Bibliographische Detailangaben
Hauptverfasser: WORKMAN, THOMAS, SUR, BISWAJIT, VODRAHALLI, NAGESH K
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An assembly comprising: a die (50) having a surface; an adhesion layer (82, 84) of metal coupled to the surface; a solder-wettable layer (86) coupled to the adhesion layer; a lid (52); and a solderable thermally conductive element (60) to couple the lid to the solder-wettable layer.