SAMPLE PROCESSING DEVICES

Methods and devices for thermal processing of multiple samples at the same time are disclosed. The assemblies include carriers and sample processing devices with process arrays that include conduits useful in distributing sample materials to a group of process chambers located in fluid communication...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	NORTH, DIANE, WOOD, KENNETH, B, BEDINGHAM, WILLIAM, DUFRESNE, JOEL, R, KOKAISEL, CHRISTOPHER, R, ROBOLE, BARRY, W, HARMS, MICHAEL, R
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	APPARATUS FOR ENZYMOLOGY OR MICROBIOLOGY BEER BIOCHEMISTRY BLASTING CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY CHEMISTRY DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS,IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KINDOF FURNACE ENZYMOLOGY FURNACES FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL HEATING INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES KILNS LIGHTING MEASURING MECHANICAL ENGINEERING METALLURGY MICROBIOLOGY MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY MUTATION OR GENETIC ENGINEERING OPEN SINTERING OR LIKE APPARATUS OVENS PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL PHYSICS RETORTS SPIRITS TESTING THEIR RELEVANT APPARATUS TRANSPORTING VINEGAR WEAPONS WINE
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Beschreibung
Zusammenfassung:	Methods and devices for thermal processing of multiple samples at the same time are disclosed. The assemblies include carriers and sample processing devices with process arrays that include conduits useful in distributing sample materials to a group of process chambers located in fluid communication with the main conduits. The sample processing devices may include one or more of the following features in various combinations: deformable seals, process chambers connected to the main conduit by feeder conduits exciting the main conduit at offset locations, U-shaped loading chambers, and a combination of melt bonded and adhesively bonded areas. The carriers may be used to apply selective compression to the sample processing devices.