Semiconductor device and method of making the same

A semiconductor device 11 includes a housing 12, which is formed of a polyamide-series thermoplastic resin, and semiconductor package 13 sealed in the housing 12, which is formed of a thermosetting epoxy resin. The package 13 has a modified face 13a that is modified by UV-irradiation to have adhesiv...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	TAJIMA, MASAYA, WATANABE, MITSUO, KOGISO, KATSUYA, MATSUBARA, TOSHIKI, SATO, KENJI
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A semiconductor device 11 includes a housing 12, which is formed of a polyamide-series thermoplastic resin, and semiconductor package 13 sealed in the housing 12, which is formed of a thermosetting epoxy resin. The package 13 has a modified face 13a that is modified by UV-irradiation to have adhesive properties to polyamide. A plurality of connector terminals 14 extend from the packages 13 in parallel. A portion of the terminals 14 is also sealed in the housing 12 together with the package 13. Thus, the device 11 is easily produced by insert molding and has excellent moisture resistance.