Electric module

The module (10) consists of a stamped metal blank forming a ladder arrangement (12). This is connected on one side to a heat sink (14) and on the other a number of IC chips (e.g. Power MOSFETS) providing both electrical and thermal conduction. Between the metal blank and the heat sink an insulating...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	GIESEN, MARKO, STADLER, PETER, TROMMER, FRANK O, GAERTNER, MARKUS, SCHULTE, THOMAS
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The module (10) consists of a stamped metal blank forming a ladder arrangement (12). This is connected on one side to a heat sink (14) and on the other a number of IC chips (e.g. Power MOSFETS) providing both electrical and thermal conduction. Between the metal blank and the heat sink an insulating layer (18) is provided in the form of a foil or glue, or similar with thermal conduction properties.