PVD coating process magnetron cathodic sputtering

PVD process for coating substrates comprises pre-treating a substrate in the vapor produced by pulsed magnetic field-supported cathode sputtering. During the pre-treatment a magnetic field arrangement in the form of a magnetron cathode is used to support the magnetic field. The intensity of the hori...

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Bibliographische Detailangaben
Hauptverfasser:	HOVSEPIAN, PAPKEN EH, MUENZ, WOLF-DIETER, DR, EHIASARIAN, ARUTIUN P
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PVD process for coating substrates comprises pre-treating a substrate in the vapor produced by pulsed magnetic field-supported cathode sputtering. During the pre-treatment a magnetic field arrangement in the form of a magnetron cathode is used to support the magnetic field. The intensity of the horizontal component in front of the target is 100-1500 Gauss. After the pre-treatment a further coating step takes place using cathode sputtering. The power density of the pulsed discharge during pre-treatment is over 1000 W.cm. Preferred Features: The power density is 2000-3000 W.cm. The pulse duration is 10-1000, preferably 50 micro-s, and the pulse interval is 0.2 ms to 1000 s, preferably 20 ms. The pre-treatment takes place in an non-reactive atmosphere. e.g. Ne, Ar, Kr, or Se with targets made from Cr, V, Ti, Zr, Mo, W, Nb, or Ta.