Method of soldering plastic flex circuits boards by diode laser

A method to solder flex circuits (10,12) by diode laser. First and second flex circuits (10,12) composed of polymer flex substrate are provided. Each flex circuit (10,12) has a top and a bottom side and at least one contact trace (16) embedded in its surface. An area of solder (24) is provided on th...

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Bibliographische Detailangaben
Hauptverfasser:	SHI, ZHONG-YOU, SINKUNAS, PETER J, BULLOCK, LAWRENCE L
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CURRENT COLLECTORS CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A method to solder flex circuits (10,12) by diode laser. First and second flex circuits (10,12) composed of polymer flex substrate are provided. Each flex circuit (10,12) has a top and a bottom side and at least one contact trace (16) embedded in its surface. An area of solder (24) is provided on the contact trace (16) of at least one of the flex circuits (10,12) and the flex circuits (10,12) are positioned so that the contact traces (16) of each flex circuit (10,12) are substantially aligned. A laser beam is positioned to heat the contact trace (16) to melt the solder (24) and fuse the contacts (16).