Flexible printed circuit board

A flexible printed circuit board (FPC) comprises a base film (1); a base film side adhesive layer (2) provided on the base film; a metal foil layer (3) on which a pattern circuit is formed provided on the base film side adhesive layer; and a cover layer side adhesive layer (4) provided on the metal...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	KUROSAWA, YUKIHIKO, JUMONJI, SADAMITSU, TANABE, NOBUO, ARAI, MASAHIKO, OKADA, KENICHI, IMAI, TAKAYUKI, KAIZU, MASAHIRO
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A flexible printed circuit board (FPC) comprises a base film (1); a base film side adhesive layer (2) provided on the base film; a metal foil layer (3) on which a pattern circuit is formed provided on the base film side adhesive layer; and a cover layer side adhesive layer (4) provided on the metal foil layer, wherein at least one of the base film side adhesive (2) and the cover layer side adhesive layer (4) has a higher glass transition temperature than the working environment temperature of the flexible printed circuit board, so that the FPC has a stable flexibility at high temperature.