Semiconductor package
A semiconductor package includes (a) an interposer (40), (b) a wiring layer (50) containing conductors formed adjacent to each other at intervals that cause no short circuit among the conductors, the wiring layer (50) covering a given area of the interposer (40), to block light from passing through...
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| Format: | Patent |
| Sprache: | eng ; fre ; ger |
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| Zusammenfassung: | A semiconductor package includes (a) an interposer (40), (b) a wiring layer (50) containing conductors formed adjacent to each other at intervals that cause no short circuit among the conductors, the wiring layer (50) covering a given area of the interposer (40), to block light from passing through the given area, (c) a light blocking layer (80) covering a no-wiring area of the interposer (40) not covered by the wiring layer (50), to block light from passing through the no-wiring area, (d) a semiconductor chip (10) electrically connected to the wiring layer (50), and (e) a resin mold sealing the wiring layer (50); the light blocking layer (80) and the semiconductor chip (10). |
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