LAMINATE AND PROCESS FOR PRODUCING THE SAME

This invention relates to a laminate which changes in dimension to such a small extent as not to cause curling and warpage when the ambient humidity changes and is useful for flexible printed wiring boards. The laminate possesses a polyimide layer or layers of polyimides formed on a conductor by coa...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	OKAMURA, KAZUTO, OHTA, TAKUHEI, HIRAISHI, KATSUFUMI, SHIMOSE, MAKOTO, OKABAYASHI, NAOYA, OOMIZO, KAZUNORI
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	This invention relates to a laminate which changes in dimension to such a small extent as not to cause curling and warpage when the ambient humidity changes and is useful for flexible printed wiring boards. The laminate possesses a polyimide layer or layers of polyimides formed on a conductor by coating and at least one of the polyimide layers is composed of polyimide of low hygroscopic expansion obtained by the reaction of diamines containing 20 mol% or more of 4,4'-diamino-2,2'-dimethylbiphenyl with a tetracarboxylic acid compound and exhibiting a coefficient of linear hygroscopic expansion of 15 x 10 /%RH or less.