MULTILAYER PRINTED BOARD
Disclosed is a multilayer printed board to be provided with electronic components, which has at least one layer whose thermal expansion behavior corresponds approximately to the thermal expansion behavior of the electronic components while at the same time substantially determining the thermal expan...
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creator | KRABE, DETLEF DIETZ, MATHIAS SCHEEL, WOLFGANG CYGON, MANFRED |
description | Disclosed is a multilayer printed board to be provided with electronic components, which has at least one layer whose thermal expansion behavior corresponds approximately to the thermal expansion behavior of the electronic components while at the same time substantially determining the thermal expansion behavior of the multilayer printed board. |
format | Patent |
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fre ; ger</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2003</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20030611&DB=EPODOC&CC=EP&NR=1240809B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20030611&DB=EPODOC&CC=EP&NR=1240809B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KRABE, DETLEF</creatorcontrib><creatorcontrib>DIETZ, MATHIAS</creatorcontrib><creatorcontrib>SCHEEL, WOLFGANG</creatorcontrib><creatorcontrib>CYGON, MANFRED</creatorcontrib><title>MULTILAYER PRINTED BOARD</title><description>Disclosed is a multilayer printed board to be provided with electronic components, which has at least one layer whose thermal expansion behavior corresponds approximately to the thermal expansion behavior of the electronic components while at the same time substantially determining the thermal expansion behavior of the multilayer printed board.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2003</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJDwDfUJ8fRxjHQNUggI8vQLcXVRcPJ3DHLhYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxrgGGRiYGFgaWTobGRCgBAMFLH18</recordid><startdate>20030611</startdate><enddate>20030611</enddate><creator>KRABE, DETLEF</creator><creator>DIETZ, MATHIAS</creator><creator>SCHEEL, WOLFGANG</creator><creator>CYGON, MANFRED</creator><scope>EVB</scope></search><sort><creationdate>20030611</creationdate><title>MULTILAYER PRINTED BOARD</title><author>KRABE, DETLEF ; DIETZ, MATHIAS ; SCHEEL, WOLFGANG ; CYGON, MANFRED</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP1240809B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2003</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>KRABE, DETLEF</creatorcontrib><creatorcontrib>DIETZ, MATHIAS</creatorcontrib><creatorcontrib>SCHEEL, WOLFGANG</creatorcontrib><creatorcontrib>CYGON, MANFRED</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KRABE, DETLEF</au><au>DIETZ, MATHIAS</au><au>SCHEEL, WOLFGANG</au><au>CYGON, MANFRED</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MULTILAYER PRINTED BOARD</title><date>2003-06-11</date><risdate>2003</risdate><abstract>Disclosed is a multilayer printed board to be provided with electronic components, which has at least one layer whose thermal expansion behavior corresponds approximately to the thermal expansion behavior of the electronic components while at the same time substantially determining the thermal expansion behavior of the multilayer printed board.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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language | eng ; fre ; ger |
recordid | cdi_epo_espacenet_EP1240809B1 |
source | esp@cenet |
subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
title | MULTILAYER PRINTED BOARD |
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