MULTILAYER PRINTED BOARD

Disclosed is a multilayer printed board to be provided with electronic components, which has at least one layer whose thermal expansion behavior corresponds approximately to the thermal expansion behavior of the electronic components while at the same time substantially determining the thermal expan...

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Bibliographische Detailangaben
Hauptverfasser:	KRABE, DETLEF, DIETZ, MATHIAS, SCHEEL, WOLFGANG, CYGON, MANFRED
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	Disclosed is a multilayer printed board to be provided with electronic components, which has at least one layer whose thermal expansion behavior corresponds approximately to the thermal expansion behavior of the electronic components while at the same time substantially determining the thermal expansion behavior of the multilayer printed board.