METHOD AND DEVICE FOR FLUX-FREE SOLDERING WITH REACTIVE GAS-ENRICHED MOLTEN METALS

In prior art, fluxing agents are used in wave soldering devices to prevent the metal parts to be soldered or the soldering bath from oxidizing (formation of scabs). The remainders of said fluxing agents can impair the quality of the soldered joint or of the soldered workpiece. The aim of the invention to provide a method and a device with which the use of fluxing agents for soldering can be reduced. To this end, before the actual soldering step, a reducing reactive gas, for example hydrogen, is dissolved in the liquid soldering agent by introducing a gas electrode into the soldering bath. When the soldering agent cools off on the workpiece once the soldering is completed, a part of the dissolved reactive gas evaporates and has a reducing effect on the workpiece or on the soldering agent, thereby at least substantially reducing the need for using a fluxing agent.