Wafer planarization apparatus and planarization method thereof

Wafers (26) are prevented from getting damaged on delivery thereof from a sucking and carrying device to a table (48, 52, 54). A wafer (26) before planarization sucked and held by a sucking board (68, 80) is positioned above a table (48, 52, 54). Next, wafer (26) is vacuum-attracted by the table (48...

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Bibliographische Detailangaben
1. Verfasser:	KAWASHIMA, ISAMU
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT CONVEYING DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING HAND TOOLS HANDLING THIN OR FILAMENTARY MATERIAL MACHINE TOOLS MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MANIPULATORS METAL-WORKING NOT OTHERWISE PROVIDED FOR PACKING PERFORMING OPERATIONS PNEUMATIC TUBE CONVEYORS POLISHING PORTABLE POWER-DRIVEN TOOLS SEMICONDUCTOR DEVICES SHOP CONVEYOR SYSTEMS STORING TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FORFASTENING, CONNECTING, DISENGAGING OR HOLDING TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING TRANSPORTING
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Beschreibung
Zusammenfassung:	Wafers (26) are prevented from getting damaged on delivery thereof from a sucking and carrying device to a table (48, 52, 54). A wafer (26) before planarization sucked and held by a sucking board (68, 80) is positioned above a table (48, 52, 54). Next, wafer (26) is vacuum-attracted by the table (48, 52, 54), and the table (48, 52, 54) is moved upward by that attraction power in a direction to suck the wafer (26) so as to vacuum-suck it on the table (48, 52, 54). Subsequently, the wafer (26) is sucked and held only by the table (48, 52, 54) by releasing the sucking and holding thereof by the sucking board (68, 80).