Bonding by adhesives containing nanoparticles

A process for bonding at least two substrates with a hotmelt adhesive using microwave energy is provided. The process includes applying a microwave-activatable primer to a least one of the substrates and applying a hotmelt adhesive to a least one of the substrates. The method also includes pressing...

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Bibliographische Detailangaben
Hauptverfasser:	DAUSMANN, DIETER, KIRSTEN, CHRISTIAN, N, MATHES, NIKOLAUS, FRANKEN, UWE
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	A process for bonding at least two substrates with a hotmelt adhesive using microwave energy is provided. The process includes applying a microwave-activatable primer to a least one of the substrates and applying a hotmelt adhesive to a least one of the substrates. The method also includes pressing the substrates together so that the microwave-activatable primer and the hot melt adhesive are between the substrates, and exposing at least the microwave-activatable primer to microwaves to heat the hotmelt adhesive. The present invention also provides a process for spraying a hot melt adhesive onto a substrate where the hot melt adhesive includes nanoparticles having ferromagnetic, ferrimagnetic, superparamagnetic or piezoelectric properties.