Tubular target and method for its production

Tubular target (1) comprises a tubular sputtering material (3) and a supporting tube. The sputtering material has a circular cross-section and concentrically surrounds the tube. The tube protrudes from the sputtering material at the connection to a cathode sputtering device on one end of the target....

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Bibliographische Detailangaben
Hauptverfasser:	WARKENTIN, OLIVER, STENGER, BERND, LUPTON, DAVID FRANCIS, HECK, RALF
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	Tubular target (1) comprises a tubular sputtering material (3) and a supporting tube. The sputtering material has a circular cross-section and concentrically surrounds the tube. The tube protrudes from the sputtering material at the connection to a cathode sputtering device on one end of the target. The part of the supporting tube protruding from the sputtering material is an individual part (2a) attached by a screw. An Independent claim is also included for a process for the manufacture of a tubular target. Preferred Features: The screw is formed from an O-ring seal (5) between a first chamber outside of the target and a second chamber within the target. The sputtering material is made from Ag, Au, Zn, Al, Cu, Nb, Ni, Cu or their alloys; or is made from Si, Sn, In, Bi or their alloys; or is made from ZnO, TIO2 or In-Zn oxide.