Additive for organic resin and organic resin composition
An additive for organic resin comprising a powder comprising (A) a liquid organopolysiloxane having at least 0.001 wt% of silicon-bonded hydrogen atoms and at least 50 dimethylsiloxy repeating units and (B) an inorganic powder; and an organic resin comprising the additive.
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| creator | FURUKAWA, HARUHIKO SHIROMOTO, KOJI UEKI, HIROSHI MORITA, YOSHITSUGU |
| description | An additive for organic resin comprising a powder comprising (A) a liquid organopolysiloxane having at least 0.001 wt% of silicon-bonded hydrogen atoms and at least 50 dimethylsiloxy repeating units and (B) an inorganic powder; and an organic resin comprising the additive. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP1205519B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP1205519B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP1205519B13</originalsourceid><addsrcrecordid>eNrjZLBwTEnJLMksS1VIyy9SyC9KT8zLTFYoSi3OzFNIzEtBE0nOzy3ILwaqz8_jYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxrgGGRgampoaWTobGRCgBAK-oLfc</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Additive for organic resin and organic resin composition</title><source>esp@cenet</source><creator>FURUKAWA, HARUHIKO ; SHIROMOTO, KOJI ; UEKI, HIROSHI ; MORITA, YOSHITSUGU</creator><creatorcontrib>FURUKAWA, HARUHIKO ; SHIROMOTO, KOJI ; UEKI, HIROSHI ; MORITA, YOSHITSUGU</creatorcontrib><description>An additive for organic resin comprising a powder comprising (A) a liquid organopolysiloxane having at least 0.001 wt% of silicon-bonded hydrogen atoms and at least 50 dimethylsiloxy repeating units and (B) an inorganic powder; and an organic resin comprising the additive.</description><edition>7</edition><language>eng ; fre ; ger</language><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; GENERAL PROCESSES OF COMPOUNDING ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS ; WORKING-UP</subject><creationdate>2004</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20040818&DB=EPODOC&CC=EP&NR=1205519B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20040818&DB=EPODOC&CC=EP&NR=1205519B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FURUKAWA, HARUHIKO</creatorcontrib><creatorcontrib>SHIROMOTO, KOJI</creatorcontrib><creatorcontrib>UEKI, HIROSHI</creatorcontrib><creatorcontrib>MORITA, YOSHITSUGU</creatorcontrib><title>Additive for organic resin and organic resin composition</title><description>An additive for organic resin comprising a powder comprising (A) a liquid organopolysiloxane having at least 0.001 wt% of silicon-bonded hydrogen atoms and at least 50 dimethylsiloxy repeating units and (B) an inorganic powder; and an organic resin comprising the additive.</description><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2004</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLBwTEnJLMksS1VIyy9SyC9KT8zLTFYoSi3OzFNIzEtBE0nOzy3ILwaqz8_jYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxrgGGRgampoaWTobGRCgBAK-oLfc</recordid><startdate>20040818</startdate><enddate>20040818</enddate><creator>FURUKAWA, HARUHIKO</creator><creator>SHIROMOTO, KOJI</creator><creator>UEKI, HIROSHI</creator><creator>MORITA, YOSHITSUGU</creator><scope>EVB</scope></search><sort><creationdate>20040818</creationdate><title>Additive for organic resin and organic resin composition</title><author>FURUKAWA, HARUHIKO ; SHIROMOTO, KOJI ; UEKI, HIROSHI ; MORITA, YOSHITSUGU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP1205519B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2004</creationdate><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>FURUKAWA, HARUHIKO</creatorcontrib><creatorcontrib>SHIROMOTO, KOJI</creatorcontrib><creatorcontrib>UEKI, HIROSHI</creatorcontrib><creatorcontrib>MORITA, YOSHITSUGU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FURUKAWA, HARUHIKO</au><au>SHIROMOTO, KOJI</au><au>UEKI, HIROSHI</au><au>MORITA, YOSHITSUGU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Additive for organic resin and organic resin composition</title><date>2004-08-18</date><risdate>2004</risdate><abstract>An additive for organic resin comprising a powder comprising (A) a liquid organopolysiloxane having at least 0.001 wt% of silicon-bonded hydrogen atoms and at least 50 dimethylsiloxy repeating units and (B) an inorganic powder; and an organic resin comprising the additive.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
| recordid | cdi_epo_espacenet_EP1205519B1 |
| source | esp@cenet |
| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP |
| title | Additive for organic resin and organic resin composition |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-06T19%3A48%3A04IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=FURUKAWA,%20HARUHIKO&rft.date=2004-08-18&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP1205519B1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |