Additive for organic resin and organic resin composition

An additive for organic resin comprising a powder comprising (A) a liquid organopolysiloxane having at least 0.001 wt% of silicon-bonded hydrogen atoms and at least 50 dimethylsiloxy repeating units and (B) an inorganic powder; and an organic resin comprising the additive.

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Bibliographische Detailangaben
Hauptverfasser:	FURUKAWA, HARUHIKO, SHIROMOTO, KOJI, UEKI, HIROSHI, MORITA, YOSHITSUGU
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	An additive for organic resin comprising a powder comprising (A) a liquid organopolysiloxane having at least 0.001 wt% of silicon-bonded hydrogen atoms and at least 50 dimethylsiloxy repeating units and (B) an inorganic powder; and an organic resin comprising the additive.