Housing for an electronic component

A housing 70 for an electronic component has a set of walls for surrounding the component. The component is snap-fitted into the housing to retain it in the housing through snap-fit features 72 in the housing and snap-fit features 74 on the component. The housing can incorporate springs 76 which, in...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: MORRIS, TIMOTHY JOHN, MCGRANE, KEVIN
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A housing 70 for an electronic component has a set of walls for surrounding the component. The component is snap-fitted into the housing to retain it in the housing through snap-fit features 72 in the housing and snap-fit features 74 on the component. The housing can incorporate springs 76 which, in use, bias the component into contact with the snap-fit features. If the component is a transformer, the springs can act on the transformer laminations to press the stack of laminations together whilst biasing the component into contact with the snap-fit features.