MULTICHIP MODULE AND METHOD FOR PRODUCING A MULTICHIP MODULE

Multi-chip module comprises a base chip, a top chip, an adhesive layer, an electrically conducting planarizing layer, a through-hole and a contact structure. Multi-chip module comprises a base chip (10) having a passivating layer (12) and a connecting layer (14); a top chip having a passivating laye...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	LANDESBERGER, CHRISTOF, ANSORGE, FRANK, EHRMANN, OSWIN, RAMM, PETER, REICHL, HERBERT
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Multi-chip module comprises a base chip, a top chip, an adhesive layer, an electrically conducting planarizing layer, a through-hole and a contact structure. Multi-chip module comprises a base chip (10) having a passivating layer (12) and a connecting layer (14); a top chip having a passivating layer (18) and a connecting layer (20); an adhesive layer (22) between the passivating layer (12) of the base chip and the lower side of the top chip and the top chip and the base chip; an electrically conducting planarizing layer (24) on the surface of the base chip and embedded in the top chip; a through-hole (26a) filled with electrically conducting material; and a contact structure (28, 30) to connect the electrically conducting material in the through-hole to the connecting surface of the top chip.